| Authors | Alam, M.T., Hasan, M.M. |
|---|---|
| Title | Thermal Simulation of 3D High Power GaN HEMT with a Low Cost Technique to Reduce Junction Temperature Due to Self Heating (2021) 2021 5th International Conference on Electrical Engineering and Information and Communication Technology, ICEEICT 2021, |
| Type | Conference Paper |
| Year | 2021 |
| URL | Link |
| DOI | 10.1109/ICEEICT53905.2021.9667919 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN | 9781665495226 |